Gantry-Type Electroplating Equipment

Application Scenarios & Advantages
This system is ideal for small-batch, multi-variety electroplating (zinc, copper, nickel, chromium, tin, gold, silver, phosphating, oxidation, electrocoating, electroless plating, etc.) and supports rack, barrel, vibration sieve, and rotary plating, with flexible program control enabling mixed-variety processing and intelligent switching to maximize throughput. Its compact, stable hoist design offers optional liquid catchment, dehydration, and enclosed exhaust, while anti-slip tracks, auxiliary braking, and programmable controls ensure reliable operation in alkaline, humid environments. Multi-directional agitation, optimized piping, jet-flow, improved electrode layout, and high-current shielding further enhance coating uniformity, shorten cycle times, and reduce material usage.

Chemical Plating Equipment

Chemical Plating Equipment, used for mainstream plating processes such as chemical copper, chemical nickel, chemical palladium, and chemical tin, requires precise control over temperature due to the sensitivity of plating thickness. To achieve uniform heating and optimal coating results, the heating system is either designed with a water bath or utilizes a temperature-controlled heating or cooling method, ensuring even heat distribution in the plating solution.

Phosphating and Electrophoresis Equipment

Phosphating and Electrophoresis Equipment features a water-bath phosphating tank with a conical bottom design for easy cleaning. The electrophoresis tank uses membrane tube anodes to control the acidityand conductivity of the bath solution. Special piping design prevents air pocketformation on workpieces.Additionally, a linear drying temperature curve is implemented to prevent paint film blistering or poor adhesion rates.

Building Materials and Hardware Electroplating Equipment

Building Materials and Hardware Electroplating Equipment features a unique hoisting design that facilitates the draining of long tubular profiles and reduces cross-contamination between solutions. For large- sized workpieces, additional auxiliary anodes are incorporated to ensure a more uniform coating, bringing innovative improvements to the electroplating process.

Micro-arc Oxidation Equipment

Micro-arc Oxidation Equipment utilizes the micro-arc oxidation process to achieve high corrosion resistance and wear resistance for materials such as aluminum, magnesium, and titanium. Due to the high-voltage characteristics of micro-arc oxidation, the design includes a grid plate to isolate the anode and cathode, along with necessary protective measures to prevent electric shock risks.

Anodizing Equipment

Anodizing Equipment is designed for various oxidation processes of materials such as aluminum alloys, magnesium alloys, and titanium alloys. These include standard anodizing, hard anodizing, conductive anodizing, and chromic acid anodizing, along with subsequent processes like electrocoloring, chemical coloring, sealing, and sterilization. The products serve multiple industries, including electronics, automotive, aerospace and more.

Plastic Electroplating Equipment

Plastic Electroplating Equipment is designed to accommodate the lightweight nature of plastic parts and the tendency for tooling to easily detach. Special components are employed to ensure the smooth operation of the equipment. Additionally, a robust exhaust design is incorporated to prevent chrome mist from affecting product quality, ensuring the flawless execution of the metallization process.
FREQUENTLY ASKED QUESTIONS

Product FAQ's

  • Q1: What plating types are your electroplating equipment solutions suitable for?

    A: Our equipment solutions support a wide range of plating processes, including copper plating, nickel plating, chromium plating, tin plating, gold plating, silver plating, and alloy plating (such as tin-cobalt alloy and nickel-phosphorus alloy). Configurations can be customized according to the specific product requirements of our clients.

  • Q2: How do you ensure the stability and consistency of electroplating quality?

    A: From the planning stage, we consider critical factors such as current density distribution, electric field uniformity, and bath circulation methods to ensure coating quality. Our production lines are equipped with automated monitoring systems that regulate parameters including current, temperature, and pH value in real time, guaranteeing consistent coating thickness, adhesion, and appearance in mass production.

  • Q3: What are the common plating defects and how can they be avoided?

    A: Common defects include poor adhesion, pitting, burning, uneven color, and peeling. These are often related to bath composition, current density, temperature, and impurity contamination. Our pre-sales planning optimizes process parameters for your specific product characteristics, and our after-sales technical team can assist in quickly diagnosing and resolving any production issues that arise.

  • Q4: What discharge standards can your wastewater treatment system meet?

    A: Our wastewater treatment system solutions are custom-designed according to the environmental requirements of your plant's location. They can meet the "Emission Standard of Pollutants for Electroplating" (GB21900-2008) as well as stricter local discharge limits, including compliant treatment of characteristic pollutants such as chromium, nickel, and cyanide.

  • Q5: What pollutants does the exhaust gas treatment system primarily handle?

    A: The exhaust gases generated during electroplating processes mainly include hydrogen chloride, chromic acid mist, sulfuric acid mist, nitrogen oxides, hydrogen cyanide, and fluorides. Our exhaust gas treatment system solutions are equipped with corresponding purification devices tailored to different gas types, ensuring that both workshop air quality and boundary emissions fully comply with regulatory standards.

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